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| (R) SEM ICONDUCTOR 500 mW DO-35 Hermetically Sealed Glass Fast Switching Diodes AXIAL LEAD DO35 Absolute Maximum Ratings Symbol PD TSTG TJ WIV IO IFM IFSURGE Power Dissipation TA = 25C unless otherwise noted Value 500 -65 to +200 +175 75 150 450 2 Units mW C C V mA mA A L TC1Nxxxx DEVICE MARKING DIAGRAM Parameter Storage Temperature Range Operating Junction Temperature Working Inverse Voltage Average Rectified Current Non-repetitive Peak Forward Current Peak Forward Surge Current L xx xx : Logo : Device Code These ratings are limiting values above which the serviceability of the diode may be impaired. Specification Features: Fast Switching Device (TRR <4.0 nS) DO-35 Package (JEDEC) Through-Hole Device Type Mounting Hermetically Sealed Glass Compression Bonded Construction All external surfaces are corrosion resistant and leads are readily solderable Cathode indicated by polarity band ELECTRICAL SYMBOL Cathode Anode Electrical Characteristics Symbol BV Breakdown Voltage TA = 25C unless otherwise noted Parameter Test Condition IR=100A IR=5A Limits Min 100 75 25 5 0.62 0.72 1.0 1.0 Volts Max Unit Volts nA A IR Reverse Leakage Current VR=20V VR=75V VF Forward Voltage TC1N4448, TC1N914B TC1N4148, TC1N4148 TC1N4448, TC1N914B IF=5mA IF=10mA IF=100mA IF=IR=10mA RL=100 IRR=1mA TRR Reverse Recovery Time 4 nS C Capacitance VR=0V, f=1MHZ 4 pF March 2002 / A Page 1 TC1N4148/TC1N4448/TC1N914B TAK CHEONG (R) TAK CHEONG SEM ICONDUCTOR Typical Characteristics I (mA) Electrical Symbol Definition Symbol Parameter BV Breakdown Voltage @ IR IF IR Reverse Leakage Current @ VR BV VR IR IR VF (mV) (V) V VR Reverse Voltage IF Forward Current (nA) (A) VF Forward Voltage @ IF Ordering Information Device TC1Nxxxx TC1Nxxxx.TB TC1Nxxxx.TR TC1Nxxxx Package Bulk Tape and Ammo Tape and Reel Quantity 10,000 5,000 10,000 Others (...contact Tak Cheong sales representatives) Axial-Lead Tape Packaging Standards This axial-lead component's packaging requirements use in automatic testing and assembly equipment. And this standard practices for lead-tape packaging of axial-lead components meets the requirements of EIA Standard RS-296-D "Lead-taping of Components on Axial Lead Configuration for Automatic Insertion". March 2002 / A Page 2 (R) TAK CHEONG SEM ICONDUCTOR Tape & Reel Packaging Information Tape & Reel Outline DIM D1 Millimeters 356 30 84 77.5 Reel Dimensions D2 D3 W1 PKG Type Quantity Per Reel Quantity Per Reel DO-35 10,000 March 2002 / A Page 3 (R) TAK CHEONG SEM ICONDUCTOR Tape & Ammo Packaging Information Tape & Ammo Outline 250mm x 80mm x 80mm Quantity Per Ammo Box PKG Type DO-35 Quantity Per Box 5,000 Taping Dimensions Description Standard Width Tape Spacing (B) Component Pitch (C) Untaped Lead (L1 - L2) Glass Offset (F) Bent (D) Tape Width (G) Tape Mismatch (E) Taped Lead (G) Lead Beyond Tape (H) 52 52 0.69 5.08 0.4 0.69 0.69 1.2 Max 6.138 0.576 0.55 Max 3.2 Min 0 Millimeters 26 26 +0.5 / -0 5.08 0.4 0.69 0.69 1.2 Max 6.138 0.576 0.55 Max 3.2 Min 0 March 2002 / A Page 4 (R) TAK CHEONG SEM ICONDUCTOR Bulk Packaging Information Plastic Bag Bulk Outline Quantity Per Plastic Bag DO-35 1000 x 10 Plastic Bag 250mm x 80mm x 80mm PKG Type Quantity Per Box 10,000 Quantity Per Box DO-35 March 2002 / A Page 5 |
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